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PASTE FLUX FOR SOLDERING BGA PACKAGES AND FLIP CHIPS + TOUCH UP |
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Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types of paste flux are available: Rosin Mildly Activated PF 200, Activated Rosin PF 400, No-Clean PF600, and Water-Soluble PF 700. Available for leaded and lead free assemblies.
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PF600 No-Clean Paste Flux
Compatible With Leaded Assembly
Similar to type RMA but lighter in residues. Residues may be left on without cleaning. PF600 is a no clean paste flux formulation. Utilizing synthetically refined resin and a very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no splattering. NC600 conforms to QQ-S-571 and Classification REL0 per specification J-STD-004
| Tech. Data | SDS |
8gms./10cc syringe Part #PF600-I
Special Price $10.20 ea.
24gms./30cc syringe Part #PF600-J
Special Price $18.05 ea.
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PF608 No-Clean Paste Flux
Compatible With Lead Free Assembly
A unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high temperature lead free and conventional Sn/Pb alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread.
| Tech. Data | SDS |
8gms./10cc syringe Part #PF608-I
Special Price $10.20 ea.
24gms./30cc syringe Part #PF608-J
Special Price $18.05 ea.
400gms./1Lb. jar Part #PF608-1LB
Special Price $91.80 ea.
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PF700 Water-Soluble Paste Flux
Compatible With Leaded Assembly
Excellent tackiness. Less corrosive than most organic types. Halogen free. Residues do not need to be cleaned immediately. Classification ROM0 per specification J-STD-004 Specification.
| Tech. Data | SDS |
8gms./10cc syringe Part #PF700-I
Special Price $10.20 ea
24gms./30cc syringe Part #PF700-J Special Price $18.05 ea.
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PF708 Water-Soluble Paste Flux
Compatible With Lead Free Assembly
PF708 is a mixture of organic acid, thixotropic thickeners and surfactant, which aid in water removal of post soldering residues. Regrigeration required.
| Tech. Data | SDS |
8gms./10cc syringe Part #PF708-I
Special Price $10.20 ea.
24gms./30cc syringe Part #PF708-J
Special Price $18.05 ea.
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PF400 Rosin Activated Paste Flux Compatible With Leaded Assembly
PF400 Rosin Activated High activity. Excellent wetting chip scale packaging. Classification ROM0 per specification J-STD-004 Specification. Cleaning required. Use Qualitek 1005 or any CFC | Tech. Data | SDS |
8gms./10cc syringe Part #PF400-I Special Price $10.20 ea.
24gms./30cc syringe Part #PF400-J Special Price $18.05 ea.
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PF200 Rosin Mildly Activated Paste Flux
Compatible With Leaded Assembly
Good wetting & dispensing. Chip scale packaging production & Touch-up.Classification ROL0 per J-STD-004 Specification.
| Tech. Data | SDS |
8gms./10cc syringe Part #PF200-I
Special Price $10.20 ea.
24gms./30cc syringe Part #PF200-J
Special Price $18.05 ea.
100gms./4 oz. jar Part #PF200-F
Special Price $48.60 ea.
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PF708-F Water Soluble Paste Flux
PFPF708 is a Halogen-Free Water Soluble paste flux (also known as tacky flux) designed for Lead-Free surface mount assembly and rework applications. PF708 has high thermal stability when using high temperature Lead-Free alloys. PF708 is available in syringes for easy dispensing or in jars.
| Tech. Data | SDS |
PF708-F Special Price $28.00 ea.
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PF400 Rosin Activated Paste Flux
Compatible With Leaded Assembly
PF400 Rosin Activated
High activity. Excellent wetting chip scale packaging. Classification ROM0 per specification J-STD-004 Specification. Cleaning required. Use Qualitek 1005 or any CFC
| Tech. Data | SDS |
100gms./4 oz. jar #PF400-F
Special Price $48.60 ea.
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| MONTHLY SPECIALS | SOLDER PASTE | SOLDER FLUX | SOLDER MASK | CHEMICALS | WAVE OIL | DROSS REDUCING AGENTS | BGA SPHERES | PASTE FLUX | WIRE SOLDER | BAR SOLDER | TERMS & CONDITIONS | |
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